CIME 2027
CIME 2027 - the 18th Shenzhen International Thermal Conductive and Cooling Materials and Equipment Exhibition (also marketed as the Shenzhen International Thermal Management Materials Exhibition) - is scheduled for 16-18 June 2027 at Shenzhen World Exhibition & Convention Center (Bao'an New Hall), No. 1 Zhancheng Road, Fuhai Street, Bao'an District, Shenzhen, China.
The series was founded in Shenzhen in 2013 and has run for more than a decade. It now runs two editions a year: a Shenzhen edition in June and a Shanghai edition in December. The 2027 Shenzhen edition is planned at 60,000 sqm of exhibition space with 800 exhibitors, 30 conference sessions and an expected 50,000 trade visitors.
Exhibit profile covers the whole thermal-management chain: thermally conductive fillers (alumina, boron nitride, aluminium nitride, graphite, metal powders, liquid metal), electronic packaging materials, thermal interface materials (gap pads, gels, greases, potting compounds, phase-change materials), ceramic substrates, heat-sink materials and composites, thermally conductive polymers, carbon materials such as graphite films and graphene, thermal insulation and aerogels, heat pipes, vapour chambers and cooling modules, fans and heat-sink hardware, data-centre liquid-cooling equipment (cold plates, immersion cooling, quick connectors, coolants), plus thermal simulation software and testing instruments (laser flash thermal conductivity meters, thermal analysers).
The show is organised by Bohan Exhibition (Shenzhen/Shanghai) and Liyue Exhibition (Shenzhen), with support from industry associations including the Shenzhen Plastics Association and the Guangdong Adhesives Industry Association. It targets buyers from consumer electronics, 5G and AI hardware, data centres, power batteries and energy storage, new-energy vehicles, semiconductors and power devices, aerospace and industrial equipment.